Capital expenditure 在臉書 reaction 排行榜

1. TSMC’s Q1 Call: AI Demand Accelerates, Capacity Stays Tight (讚:0 享:0 評:0 留言:0) 2026-04-16 18:15:19
TSMCC.C. WeiAI accelerator demand3nm process2nm (N2) nodeA16 Super Power RailCoWoS packagingSilicon photonicsArizona fab expansion
2. PCB Giant Zhen Ding Technology Goes All-In on AI (讚:0 享:0 評:0 留言:0) 2026-04-16 13:29:24
Zhen Ding TechnologyPrinted Circuit Board (PCB)IC substrateABF substrateCoWoP (Chip-on-Wafer-on-PCB)Glass core substrateIntelligent HDI (iHDI)AI infrastructureNvidia packaging supply chain
3. AI’s Hidden Bottleneck: The PCB and Materials Supply Crunch (讚:0 享:0 評:0 留言:0) 2026-04-16 10:51:21
PCBABF substrateBT substrateT-glass fiberglass clothCCLUnimicronZhen Ding TechnologyCoWoS packagingIC substrate shortage
4. How AVC Became the AI Industry’s Essential Cooling Partner (讚:0 享:0 評:0 留言:0) 2026-04-16 10:03:52
AVCAsia Vital ComponentsAI coolingLiquid coolingCold plateNvidia GB200Vera RubinThermal managementASIC servers
5. ASE: The World’s Largest Chip Packager Bets Big on AI (讚:0 享:0 評:0 留言:0) 2026-04-13 13:41:16
ASE TechnologyOSATCoWoS-S packagingFOCoSCoWoPKaohsiungRenwu Industrial ParkAI chip packagingNvidia Rubin